The leaked solder point diagram of the Apple A20 standard chip reveals details about its architecture for the upcoming iPhone 18. The processor will be manufactured using TSMC N2 process technology, consistent with the A20 Pro model.
The chip die size is estimated to be between 70 and 80 square millimeters, which is smaller than the previous A19 generation. Unlike the Pro version, the A20 uses traditional PoP packaging, which suggests ongoing thermal management challenges.
Technical analysis of the layout indicates a 5-core GPU configuration, likely subject to frequency limitations. The CPU setup includes two performance cores and four efficiency cores, with L2 cache allocations of 8MB and 4MB respectively.
The chip features a dual 16-core neural engine with a dedicated 4MB cache. The memory controller layout, featuring three 32-bit groups, provides a total of 96-bit memory bandwidth to support on-device AI requirements.
Apple intends to position the A20 as a standard upgrade for the iPhone 18. The design choices indicate a strategy to increase the performance gap between the standard and Pro versions of the A-series chips.
