The upcoming AMD Ryzen Z3 series for handheld gaming devices will utilize the FF6 package, measuring 25x25 millimeters. This footprint is notably more compact than the FP8 package currently used in Strix Point chips.
The architecture, dubbed Medusa Point, features a hybrid design. It is expected to combine Zen 6 cores with low-power Zen 5 LP cores, totaling six cores and twelve threads. AMD may still adjust these specifications before the final product release.
Graphics performance is a key focus, with the series featuring 12 RDNA4m compute units. To accommodate this larger GPU, the chip design reduces the count of Zen 6c CPU cores, reallocating silicon area and power budget to the graphics component.
The RDNA4m architecture is a derivative of RDNA 3.5. It integrates RDNA 4-level ALUs designed for matrix operations, which provides native support for technologies like FSR 4. This feature is expected to remain relevant for future software functions.
Regarding power efficiency and market positioning, the standard Ryzen Z3 is optimized for a 15W power envelope. The more powerful Ryzen Z3 Extreme variant is designed to operate at approximately 25W.
