Alibaba's T-Head semiconductor division unveiled its roadmap for the Yitian server CPU series at the 2026 Yunqi Conference in Hangzhou. The company plans to release the Yitian 720 and Yitian 730 models in 2027.
The Yitian 720 is designed to improve single-core performance, core density, and energy efficiency. The Yitian 730 will be the first to utilize T-Head's proprietary CPU microarchitecture, delivering a 1.4x increase in SPECint2017/GHz performance compared to the Yitian 710.
Looking ahead, T-Head plans to introduce the Yitian 750, which will incorporate the company's second-generation self-developed core. This model will support the proprietary ICN interconnect bus protocol, allowing direct communication between Yitian CPUs and Zhenwu AI chips.
T-Head currently maintains a portfolio of data center hardware, including the Zhenwu AI chip series, ICNSwitch interconnect chips, Panmai smart network cards, and Zhenyue storage controller chips. These components are designed to provide full-stack self-developed computing, networking, and storage capabilities.
